Near-packaged Optics (NPO) Testing Solutions
Near-packaged Optics (NPO) is an innovative optical interconnect technology that sits between traditional pluggable optical modules and Co-Packaged Optics (CPO). By placing the optical engine in very close proximity to the switch chip, NPO achieves shorter optoelectronic signal transmission paths while maintaining the advantages of serviceability and upgradability.
Compared to CPO, NPO is easier to implement technologically and has a clearer path to commercialization, while significantly reducing power consumption and increasing bandwidth density. Sunyu Photonics provides professional wafer-level and chip-level testing solutions for NPO, helping customers achieve efficient and reliable testing during product development and mass production. Our system is optimized for the high-density optoelectronic integration characteristics of NPO devices, supporting multi-channel parallel testing while balancing optical coupling precision with test throughput.
Co-Packaged Optics
Near-Packaged Optics
Note: NPO serves as a transitional solution between CPO and traditional pluggable modules, offering a balanced approach between performance and manufacturability for near-term data center upgrades
Supports multi-channel parallel testing, significantly reducing single chip test time to meet high-throughput production needs
Supports 200G to 3.2T high-speed optical signal testing, covering the rates required for next-generation data center interconnects
Provides complete eye diagram analysis function, intuitively evaluating signal quality and link integrity, helping with rapid diagnostics
Fully automated probe station integration, including six-axis motion stage, fiber array FAU, microscope, etc.
Common questions about NPO testing
NPO as a transitional solution has relatively lower packaging complexity and technical difficulty, making it easier to implement; CPO represents a longer-term technology direction. We provide professional recommendations based on your product positioning and application scenarios.
Our system supports 4-inch, 6-inch, 8-inch, and 12-inch (300mm) wafers, meeting various requirements from R&D to mass production.
NPO devices have higher channel density and stronger optoelectronic integration, requiring more precise alignment systems and higher-efficiency parallel testing capabilities. Our system is specifically optimized for these characteristics.
Yes, we have a testing laboratory at Singapore Science Park and can provide wafer testing services and system demonstrations for customers.
Yes, Navigo software provides rich API interfaces, supporting secondary development and customization according to customer needs.
The delivery cycle for standard products is typically 6-8 months, and customized products are determined based on specific requirements.
