Silicon photonics wafer testing faces many challenges, mainly in technical complexity, test speed, precision, and cost

High Precision: Silicon photonics testing needs sub-micron or nanometer alignment precision.
High Speed: Fast automated testing needed for large-scale silicon photonics production.
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Optical Alignment: Micron misalignment causes inaccurate test results for photonic devices.
Multi-Parameter Testing: Silicon photonics testing includes IL, PDL, I-V, bandwidth, and eye diagrams.
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Diversity: Silicon photonics devices (modulators, detectors, etc.) have different test methods.
Integration: Increased integration demands testing of more complex optoelectronic functions.
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Equipment Cost: High-precision test equipment is expensive; balance performance and cost.
Test Efficiency: Balancing efficiency and low cost in mass production challenges manufacturers.
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Large Amounts of Data:PIC testing generates large data volumes, requiring efficient processing and analysis to quickly identify and address issues.
Data Accuracy: Ensuring data accuracy and consistency to guarantee the reliability of test results.
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Automation: Increasing the level of automation in the testing process to reduce human error and improve testing efficiency.
Flexibility: Testing systems must be flexible to adapt to different silicon photonic devices and testing requirements.
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Environmental Stability: The testing environment needs to remain highly stable to avoid external interference affecting the test results, such as vibration and temperature fluctuations.
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Addressing these challenges requires advanced testing equipment, automation software, and system integration experience. Sunyu Photonics provides high-precision, high-speed automation solutions to improve PIC testing efficiency and quality.
Learn More →Our wafer-level automation test solutions, controlled by Navigo software, integrate high-precision probe stations and various optoelectronic test instruments
Our automation test system is designed for silicon photonics chips, achieving high-precision, high-efficiency wafer-level testing. Supports comprehensive testing from R&D to production.

For Co-Packaged Optics (CPO) technology, we provide specialized testing solutions to meet the needs of next-generation data center interconnects.

For Near-Packaged Optics (NPO) technology, we provide specialized test solutions to meet the needs of next-generation data center interconnect.

We have established an advanced silicon photonics testing lab in Singapore Science Park

Providing wafer testing services for local customers and clients worldwide.
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Providing system demonstrations to help customers understand our solutions.
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Customized test system development and integration services.
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