Next-Gen Data Center Interconnects

Next-Gen Data Center Interconnects

For Co-Packaged Optics (CPO), we offer customized test solutions to meet next-gen data center interconnect demands. CPO integrates optical transceivers with switching chips, shortening signal paths, reducing power consumption, and increasing bandwidth density—a key future trend. With flexible test architecture and deep technical expertise, we enable efficient, reliable optoelectronic co-verification from R&D to mass production.

For CPO testing, we collaborate with customers to develop dedicated wafer-level test solutions addressing high-density integration, thermal complexity, and high channel counts. Our multi-channel parallel test systems balance optical coupling precision and throughput, supporting optoelectronic parameter evaluation from R&D to production. We provide flexible, scalable solutions for silicon photonic engines, CW lasers, and switching chips, accelerating CPO products from design to market.

CPO vs NPO: Key Differences

CPO

Co-Packaged Optics

NPO

Near-Packaged Optics

Packaging Position
Optical devices co-packaged with switch chip on same substrate/chip
Optical devices placed in very close proximity to switch chip
Electrical Path
Shortest (only a few mm)
Shorter (10-20mm)
Power Consumption
Lowest
Lower (30-50% less than pluggable)
Bandwidth Density
Highest
High
Complexity
Very High
Medium
Thermal Management
Extremely Challenging
Easier to Manage
Maintainability
Lower (requires full replacement)
Higher
Maturity
Early Development
More Mature (Easier to Implement)

Note: NPO serves as a transitional solution between CPO and traditional pluggable modules, offering a balanced approach between performance and manufacturability for near-term data center upgrades

Our CPO Testing Solutions

Multi-Channel Parallel Testing

Multi-Channel Parallel Testingg

Supports multi-channel parallel testing, significantly reducing single-chip test time and meeting high-throughput production demands

High-Speed Optical Signal Testing

High-Speed Optical Signal Testing

Supports high-speed optical signal testing from 200G to 3.2T, covering the data rates required for next-generation data center interconnects

Eye Diagram Analysis

Eye Diagram Analysis

Provides comprehensive eye diagram analysis for signal quality and link integrity, enabling rapid diagnostics

Automated Wafer-Level Test Platform

Automated Wafer-Level Test Platform

Integrated fully automated probe station, comprising hexapod positioning stage, fiber array unit (FAU), microscope, and other essential components.

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Frequently Asked Questions

Common questions about silicon photonics testing

What wafer sizes does your system support?

Our system supports 4", 6", 8" and 12" (300mm) wafers, meeting various needs from R&D to production.

What's the difference between edge-coupling and grating coupler?

Edge-coupling is suitable for high coupling efficiency scenarios, while grating coupler is better for mass production.

Which is better for my product, NPO or CPO?

NPO as a transitional solution has relatively lower packaging complexity and technical difficulty, making it easier to implement; CPO represents a longer-term technology direction. We provide professional recommendations based on your product positioning and application scenarios.

What precision can your system achieve?

Our system achieves sub-micron to nanometer alignment precision, fully meeting silicon photonic device testing requirements.

Do you provide testing services?

Yes, we have a testing laboratory at Singapore Science Park, providing wafer testing services and system demonstrations.

Does Navigo software support secondary development?

Yes, Navigo provides rich API interfaces, supporting customer customization and secondary development.

What is your delivery cycle?

Standard products typically take 6-8 months, customized products depend on specific requirements.